Duty rate for Electronic integrated circuits.
Tariff Item | Description of Goods | Units of Measure | MFN Tariff | Applicable Preferential Tariffs |
---|---|---|---|---|
85.42 | Electronic integrated circuits. | |||
8542.3 | Electronic integrated circuits: | |||
8542.31 | Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits | |||
8542.31.10 | Monolithic integrated circuits | Free | CCCT, LDCT, GPT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free | |
8542.31.10.1 | Digital, for high definition television, having greater than 100,000 gates: | Free | ||
8542.31.10.11 | Metal oxide semiconductors (MOS technology) | NMB | Free | |
8542.31.10.12 | Circuits obtained by bipolar technology | NMB | Free | |
8542.31.10.19 | Other, including circuits obtained by a combination of bipolar and MOS technologies (BiMOS technology) | NMB | Free | |
8542.31.10.2 | Digital, for unmounted chips, dice or wafers, of silicon: | NMB | Free | |
8542.31.10.21 | Metal oxide semiconductors (MOS technology) | NMB | Free | |
8542.31.10.22 | Circuits obtained by bipolar technology | NMB | Free | |
8542.31.10.29 | Other, including circuits obtained by a combination of bipolar and MOS technologies (BiMOS technology) | NMB | Free | |
8542.31.10.3 | Digital, for unmounted chips, dice or wafers, other than silicon: | NMB | Free | |
8542.31.10.31 | Metal oxide semiconductors (MOS technology) | NMB | Free | |
8542.31.10.32 | Circuits obtained by bipolar technology | NMB | Free | |
8542.31.10.39 | Other, including circuits obtained by a combination of bipolar and MOS technologies (BiMOS technology) | NMB | Free | |
8542.31.10.4 | Digital, for mounted silicon metal oxide semiconductors (MOS technology), other than memory: | NMB | Free | |
8542.31.10.41 | Microprocessors having an internal data bus of 8 bits or less | NMB | Free | |
8542.31.10.42 | Microprocessors having an internal data bus of 16 bits | NMB | Free | |
8542.31.10.43 | Microprocessors having an internal data bus of 32 bits or more | NMB | Free | |
8542.31.10.49 | Other | NMB | Free | |
8542.31.10.90 | Other | NMB | Free | |
8542.31.90 | Other | NMB | 6.5 % | CCCT, LDCT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.31.90.00 | Other | – | 6.5 % | CCCT, LDCT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.32 | Memories | – | 6.5 % | |
8542.32.10 | Monolithic integrated circuits | – | Free | CCCT, LDCT, GPT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.32.10.1 | Digital, for unmounted chips, dice or wafers, of silicon: | – | Free | |
8542.32.10.11 | Metal oxide semiconductors (MOS technology) | NMB | Free | |
8542.32.10.12 | Circuits obtained by bipolar technology | NMB | Free | |
8542.32.10.19 | Other, including circuits obtained by a combination of bipolar and MOS technologies (BiMOS technology) | NMB | Free | |
8542.32.10.2 | Digital, for unmounted chips, dice or wafers, other than silicon: | NMB | Free | |
8542.32.10.21 | Metal oxide semiconductors (MOS technology) | NMB | Free | |
8542.32.10.22 | Circuits obtained by bipolar technology | NMB | Free | |
8542.32.10.29 | Other, including circuits obtained by a combination of bipolar and MOS technologies (BiMOS technology) | NMB | Free | |
8542.32.10.3 | Digital, for mounted silicon metal oxide semiconductors (MOS technology), volatile memory: | NMB | Free | |
8542.32.10.31 | Dynamic read-write random access (DRAM), not over 1 megabit | NMB | Free | |
8542.32.10.32 | Dynamic read-write random access (DRAM), over 1 megabit | NMB | Free | |
8542.32.10.33 | Static read-write random access (SRAM), not over 256 kilobits | NMB | Free | |
8542.32.10.34 | Static read-write random access (SRAM), over 256 kilobits | NMB | Free | |
8542.32.10.4 | Digital, for mounted silicon metal oxide semiconductors (MOS technology), non-volatile memory: | NMB | Free | |
8542.32.10.41 | Electrically erasable programmable read only memory (EEPROM) | NMB | Free | |
8542.32.10.42 | Erasable (except electrically) programmable read only memory (EPROM) | NMB | Free | |
8542.32.10.49 | Other | NMB | Free | |
8542.32.10.5 | Digital, for mounted silicon circuits obtained by bipolar technology: | NMB | Free | |
8542.32.10.51 | Static read-write random access memory (SRAM) | NMB | Free | |
8542.32.10.52 | Other memory | NMB | Free | |
8542.32.10.59 | Other | NMB | Free | |
8542.32.10.6 | Other mounted silicon circuits, including those obtained by a combination of bipolar and MOS technologies (BiMOS): | NMB | Free | |
8542.32.10.61 | Complementary BiMOS memory | NMB | Free | |
8542.32.10.62 | Complementary BiMOS, other than memory, including logic | NMB | Free | |
8542.32.10.69 | Other | NMB | Free | |
8542.32.10.90 | Other mounted circuits, other than silicon, including those obtained by a combination of bipolar and MOS technologies (BiMOS technology) | NMB | Free | |
8542.32.90 | Other | NMB | 6.5 % | CCCT, LDCT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.32.90.00 | Other | – | 6.5 % | CCCT, LDCT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.33 | Amplifiers | – | 6.5 % | |
8542.33.10 | Monolithic integrated circuits | – | Free | CCCT, LDCT, GPT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.33.10.1 | Digital, for unmounted chips, dice or wafers, of silicon: | – | Free | |
8542.33.10.11 | Metal oxide semiconductors (MOS technology) | NMB | Free | |
8542.33.10.12 | Circuits obtained by bipolar technology | NMB | Free | |
8542.33.10.19 | Other, including circuits obtained by a combination of bipolar and MOS technologies (BiMOS technology) | NMB | Free | |
8542.33.10.2 | Digital, for unmounted chips, dice or wafers, other than silicon: | NMB | Free | |
8542.33.10.21 | Metal oxide semiconductors (MOS technology) | NMB | Free | |
8542.33.10.22 | Circuits obtained by bipolar technology | NMB | Free | |
8542.33.10.29 | Other, including circuits obtained by a combination of bipolar and MOS technologies (BiMOS technology) | NMB | Free | |
8542.33.10.3 | Other: | NMB | Free | |
8542.33.10.31 | Unmounted chips, dice or wafers | NMB | Free | |
8542.33.10.32 | Other, with an operating frequency not less than 100 MHz | NMB | Free | |
8542.33.10.39 | Other | NMB | Free | |
8542.33.10.90 | Other | NMB | Free | |
8542.33.90 | Other | NMB | 6.5 % | CCCT, LDCT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.33.90.00 | Other | – | 6.5 % | CCCT, LDCT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.39 | Other | – | 6.5 % | |
8542.39.10 | Hybrid integrated circuits; Monolithic integrated circuits |
– | Free | CCCT, LDCT, GPT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.39.10.1 | Monolithic integrated circuits: | – | Free | |
8542.39.10.11 | Digital, for high definition television, having greater than 100,000 gates | NMB | Free | |
8542.39.10.12 | Digital, for unmounted chips, dice or wafers, of silicon | NMB | Free | |
8542.39.10.13 | Digital, for unmounted chips, dice or wafers, other than silicon | NMB | Free | |
8542.39.10.14 | Digital, mounted silicon circuits obtained by bipolar technology, other than memory, transistor-transistor logic (TTL) | NMB | Free | |
8542.39.10.15 | Digital, mounted silicon circuits obtained by bipolar technology, other than memory, emitter coupled logic (ECL) | NMB | Free | |
8542.39.10.18 | Digital, other | NMB | Free | |
8542.39.10.19 | Other | NMB | Free | |
8542.39.10.2 | Hybrid integrated circuits: | NMB | Free | |
8542.39.10.21 | With an operating frequency not less than 30 MHz | NMB | Free | |
8542.39.10.22 | Other, unmounted chips, dice or wafers | NMB | Free | |
8542.39.10.29 | Other | NMB | Free | |
8542.39.90 | Other | NMB | 6.5 % | CCCT, LDCT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.39.90.00 | Other | – | 6.5 % | CCCT, LDCT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.90.00 | Parts | – | Free | CCCT, LDCT, GPT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
8542.90.00.00 | Parts | – | Free | CCCT, LDCT, GPT, UST, MT, MUST, CIAT, CT, CRT, IT, NT, SLT, PT: Free |
For the latest tariff rate, please refer to CBSA
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